Anisotropic Conductive Film ACF for Flex-on-Glass FOG Applications

Anisotropic Conductive Film (ACF) for Film-on-Glass for LCDs is used to interconnect COF and ITO Glass

Small/Medium Panels
Large Panels/ OLB
OLED Panels

Advantages

Small/Medium Panels Large Panels/ OLB OLED Panels
Fitch pitch interconnection: 50 µm pitch for TFT-LCD, color STN, EL, High adhesion, high reliability, void-free bonding, and repairable by common solvents. Applicable for fine pitch OLB with shorter bonding time.
Fine pitch interconnect : 20µm fine pitch for TFT-LCD, color STN, EL, High adhesion, high reliability, void-free bonding, and repairable by common solvents. Low bonding temperature and short bonding time
High adhesion, high reliability, void free bonding, and repairable by common solvents. Applicable for fine pitch OLED with shorter bonding time. High reliability and adhesion property

Properties - Small and Medium LCD Panels

Item TSB21000 Series TSC3000 Series TSC5300 Series
Pitch Size
Line
µm
50
25
Space
µm
50
25
Conductive Particles
Type
—
Au/ Ni/ Polymer
Size
µm
10
4/ 5
5
Density
pcs/mm2
800
5000/ 4500
5500
Main Bonding Condition
Temp
℃
190±10
190±10
165±15
Time
sec
≥ 8
≥ 7
≥ 5
Pressure
MPa
1.5 ~ 2.0
2~3
2~3

Properties - Large Panels / OLB

Item TSC5330/40 Series EMA7870 Series
Pitch Size
Line
µm
6
10
Space
µm
14
10
Conductive Particles
Type
—
Au/Ni/Polymer or Ni/Polymer
Size
µm
3/4
3
Density
pcs/mm2
5500/7000
6000
Main Bonding Condition
Temp
℃
150 ± 20
170 ± 20
Time
sec
≥ 4
≥ 4
Pressure
MPa
3 ~ 5

Properties - OLED Panels

Item TSC22000 Series
Pitch Size
Line
µm
25
Space
µm
25
Conductive Particles
Type
—
Ni/ Polymer or Ni
Size
µm
5
Density
pcs/mm2
4500
Main Bonding Condition
Temp
℃
190±10
Time
sec
≥ 8
Pressure
MPa
2.5~3