ACF-COF
Anisotropic Conductive Film ACF for Chip-on-Flex COF Application
Advantages:
- Fine Pitch interconnection : min. 15um gap for COF application
- Min connecting area of bump : 1500um2
- High reliability and adhesion property on 2 layers of PI film
Properties
| Item | TCF7040/41 Series | ||
|---|---|---|---|
|
Pitch Size |
Line |
µm (µm2) |
1500 µm2 |
|
Space |
µm |
15 |
|
|
Conductive Particles |
Type |
— |
Au/Ni/Polymer |
|
Size |
µm |
4 |
|
|
Density |
pcs/mm2 |
40000 |
|
|
Main Bonding Condition |
Temp |
℃ |
190±10 |
|
Time |
sec |
5 ~ 10 |
|
|
Pressure |
MPa |
40~100 (per bump area of IC) |
|