ACF-COF

ACF-COG-Anisotropic-Conductive-Film

Anisotropic Conductive Film ACF for Chip-on-Flex COF Application

Advantages:

  •  Fine Pitch interconnection : min. 15um gap for COF application
  • Min connecting area of bump : 1500um2
  • High reliability and adhesion property on 2 layers of PI film

Properties

Item TCF7040/41 Series
Pitch Size
Line
µm (µm2)
1500 µm2
Space
µm
15
Conductive Particles
Type
--
Au/Ni/Polymer
Size
µm
4
Density
pcs/mm2
40000
Main Bonding Condition
Temp
190±10
Time
sec
5 ~ 10
Pressure
MPa
40~100 (per bump area of IC)