Anisotropic Conductive Film ACF for Flex-on-Board (FOB) / Flex-on-Flex (FOF) Applications

ACF-FOB/FOF is the ACF used for connecting Film (eg.,FPC) on to PCB board and other film materials or between 2 film materials.

PCB

ACF Anisotropic Conductive Film-FOB-FOG

Anisotropic Conductive Film ACF for Printed Circuit Board PCB FR4 and Flex

Advantages:

  •  High Adhesion for COF & FPC
  • Good contact resistance for reliability
  • Good for wide bonding temperature range

Properties

Item TGP20500 Series TGP5000 Series EMA8888 Series
Pitch Size
Line
µm
50
Space
µm
50
Conductive Particles
Type
--
Ni
Size
µm
3/5
5
3
Density
pcs/mm2
10000/ 1500
7500
10000
Main Bonding Condition
Temp
190±10
170±30
160±30
Time
sec
≥ 8
≥ 4
≥ 4
Pressure
MPa
3~5
2~5

Camera Module

ACF Anisotropic Conductive Film-FOB-FOG

Anisotropic Conductive Film ACF for Camera Module

Advantages:

  •  High Adhesion for Ceramic & FR-4 substrate
  • Good contact resistance for reliability
  • Easy rework for TCM & EMA & TOA Series

Properties

Item TSB2000 Series TCM5000 Series EMA1271 Series TOF5000 Series
Pitch Size
Line
µm
75 (10µm ball) ; 125 (20µm ball)
Space
µm
75 (10µm ball) ; 125 (20µm ball)
Conductive Particles
Type
--
Au/ Ni/ Polymer
Size
µm
10/20
Density
pcs/mm2
1200/ 300
Main Bonding Condition
Temp
190±10
150±10
150±20
155±5
Time
sec
≥ 7
≥ 10
≥ 7
≥ 10
Pressure
MPa
1~3

Fingerprint Sensor Module

ACF Anisotropic Conductive Film-FOB-FOG

Anisotropic Conductive Film ACF for Fingerprint Sensor Module

Advantages:

  •  Low Temperature
  • Waterproof
  • lead-free

Properties

Item TGP5010 Series TSB20522F Series TCM5022 Series
Pitch Size
Line
µm
75
125
125
Space
µm
75
125
125
Conductive Particles
Type
--
Au/Ni/Polymer
Au/Ni/Polymer + Metal
Size
µm
10
20 + 8
Density
pcs/mm2
800
200 & 500
200 & 350
Main Bonding Condition
Temp
140 ~ 200
180 ~ 200
130 ~ 180
Time
sec
≥ 4
≥ 7
≥ 6
Pressure
MPa
1.5 ~ 2.5
1 ~ 3