Anisotropic Conductive Film ACF for Flex-on-Board (FOB) / Flex-on-Flex (FOF) Applications
ACF-FOB/FOF is the ACF used for connecting Film (eg.,FPC) on to PCB board and other film materials or between 2 film materials.
PCB
Anisotropic Conductive Film ACF for Printed Circuit Board PCB FR4 and Flex
Advantages:
- High Adhesion for COF & FPC
- Good contact resistance for reliability
- Good for wide bonding temperature range
Properties
| Item | TGP20500 Series | TGP5000 Series | EMA8888 Series | ||
|---|---|---|---|---|---|
|
Pitch Size |
Line |
µm |
50 |
||
|
Space |
µm |
50 |
|||
|
Conductive Particles |
Type |
— |
Ni |
||
|
Size |
µm |
3/5 |
5 |
3 |
|
|
Density |
pcs/mm2 |
10000/ 1500 |
7500 |
10000 |
|
|
Main Bonding Condition |
Temp |
℃ |
190±10 |
170±30 |
160±30 |
|
Time |
sec |
≥ 8 |
≥ 4 |
≥ 4 |
|
|
Pressure |
MPa |
3~5 |
2~5 |
||
Camera Module
Anisotropic Conductive Film ACF for Camera Module
Advantages:
- High Adhesion for Ceramic & FR-4 substrate
- Good contact resistance for reliability
- Easy rework for TCM & EMA & TOA Series
Properties
| Item | TSB2000 Series | TCM5000 Series | EMA1271 Series | TOF5000 Series | ||
|---|---|---|---|---|---|---|
|
Pitch Size |
Line |
µm |
75 (10µm ball) ; 125 (20µm ball) |
|||
|
Space |
µm |
75 (10µm ball) ; 125 (20µm ball) |
||||
|
Conductive Particles |
Type |
— |
Au/ Ni/ Polymer |
|||
|
Size |
µm |
10/20 |
||||
|
Density |
pcs/mm2 |
1200/ 300 |
||||
|
Main Bonding Condition |
Temp |
℃ |
190±10 |
150±10 |
150±20 |
155±5 |
|
Time |
sec |
≥ 7 |
≥ 10 |
≥ 7 |
≥ 10 |
|
|
Pressure |
MPa |
1~3 |
||||
Fingerprint Sensor Module
Anisotropic Conductive Film ACF for Fingerprint Sensor Module
Advantages:
- Low Temperature
- Waterproof
- lead-free
Properties
| Item | TGP5010 Series | TSB20522F Series | TCM5022 Series | ||
|---|---|---|---|---|---|
|
Pitch Size |
Line |
µm |
75 |
125 |
125 |
|
Space |
µm |
75 |
125 |
125 |
|
|
Conductive Particles |
Type |
— |
Au/Ni/Polymer |
Au/Ni/Polymer + Metal |
|
|
Size |
µm |
10 |
20 + 8 |
||
|
Density |
pcs/mm2 |
800 |
200 & 500 |
200 & 350 |
|
|
Main Bonding Condition |
Temp |
℃ |
140 ~ 200 |
180 ~ 200 |
130 ~ 180 |
|
Time |
sec |
≥ 4 |
≥ 7 |
≥ 6 |
|
|
Pressure |
MPa |
1.5 ~ 2.5 |
1 ~ 3 |
||