Anisotropic Conductive Film ACF for Chip-on-Glass COG Application

ACF for Chip-on-Glass (COG) is suitable for fine-pitched LCDs. It is used for mounting driver IC that drives FPD display directly on to glass substrate (ITO glass).

ACF-COG

ACF-COG-Anisotropic-Conductive-Film

Advantages:

  •  Fine Pitch interconnection : min. 6um gap for COG application
  • Min connecting area of bump : 800um2
  • High reliability and adhesion property

Properties

Item TCG9031/41 Series
Pitch Size
Line
µm (µm2)
800
Space
µm
6
Conductive Particles
Type
--
Au/Ni/Polymer or Ni/Polymer
Size
µm
3/4
Density
pcs/mm2
60000
Main Bonding Condition
Temp
155±20
Time
sec
≥ 5
Pressure
MPa
3~5 (40~100 per bump area of IC)