ACF for COB

ACF-COB-Anisotropic-Conductive-Film

ACF Anisotropic Conductive Film for COB Chip-on-Board Applications

Advantages:

  • Min connecting area of bump : 1500 um2
  • High reliability and adhesion property on FR4 & Ceramic

Properties

Item TFA220 Series
Pitch Size
Line
µm (µm2)
1500 µm2
Space
µm
15
Conductive Particles
Type
--
Au coated Polymers
Size
µm
3/5
Density
pcs/mm2
40000/4500
Main Bonding Condition
Temp
180±10
Time
sec
≥ 15
Pressure
MPa
40~100 (per bump area of IC)

Various Applications of Anisotropic Conductive Film ACF

Anisotropic Conductive Film (ACF) for Film on Board (FOB) & Film on Film (FOF) Applications – ACF-FOB/FOF

Anisotropic Conductive Film (ACF) for Film on Glass (FOG) – ACF-FOG

Anisotropic Conductive Film (ACF) for IC/Chip on Glass (COG) – ACF-COG

Anisotropic Conductive Film (ACF) for Chip on Board (COB) – ACF-COB

Anisotropic Conductive Film (ACF) for Touch Panels TP – ACF-TP