ACF for COB
ACF Anisotropic Conductive Film for COB Chip-on-Board Applications
Advantages:
- Min connecting area of bump : 1500 um2
- High reliability and adhesion property on FR4 & Ceramic
Properties
| Item | TFA220 Series | ||
|---|---|---|---|
|
Pitch Size |
Line |
µm (µm2) |
1500 µm2 |
|
Space |
µm |
15 |
|
|
Conductive Particles |
Type |
— |
Au coated Polymers |
|
Size |
µm |
3/5 |
|
|
Density |
pcs/mm2 |
40000/4500 |
|
|
Main Bonding Condition |
Temp |
℃ |
180±10 |
|
Time |
sec |
≥ 15 |
|
|
Pressure |
MPa |
40~100 (per bump area of IC) |
|
Various Applications of Anisotropic Conductive Film ACF
Anisotropic Conductive Film (ACF) for Film on Board (FOB) & Film on Film (FOF) Applications – ACF-FOB/FOF
Anisotropic Conductive Film (ACF) for Film on Glass (FOG) – ACF-FOG
Anisotropic Conductive Film (ACF) for IC/Chip on Glass (COG) – ACF-COG
Anisotropic Conductive Film (ACF) for Chip on Board (COB) – ACF-COB
Anisotropic Conductive Film (ACF) for Touch Panels TP – ACF-TP